Surface Activation

CUF, MUF, underfill, flip chip and waver level packaging

In semiconductor packaging, microwave plasma cleaning and activation is used for adhesion promotion of encapsulant mold compounds or underfill materials. This includes glob top and both capillary and mold  underfill for chip, flip chip and wafer level processes. The highly reactive microwave plasma uses the chemical power of oxygen radicals to modify various substrate surfaces: solder mask materials, die passivation layers, bond pads as well as leadframe surfaces. Mold delamination problems are thus eliminated.