In chip packaging similar to 3D Interconnect, plasma cleaning is essential for improving the cleanliness of bond pads prior to wirebonding. Ball shear and stitch pull strengths are dramatically enhanced by surface plasma cleaning. Ideally, during the pull test the wire should remain welded to the bond pad while it is broken midspan. PVA TePla´s unique microwave plasma efficiently removes organic contaminants and thin oxide layers from the bond pads with unparalleled throughput. Microwave plasma processing allows for tailored surface cleaning and conditioning through the application of our proven and cost effective systems.