There are three important reasons to consider suface passivation.
1. In an in-line wafer thinning cluster tool, the time between grinding and mounting is too short for the free dangling silicon bonds to capture oxygen from the air. Once the free silicon bonds are in contact with the dicing tape, the glue reacts chemically with the tape and the die sticking force increases with time. The oxide passivation by remote plasma treatment effectively prevents these kinds of adhesion issues in thin wafer production.
2. The second reason customers apply our “Remote Plasma based Passivation” is because of the potential capture of metal ions. Oxide passivation, nitriding or other tailored surface treatment can contribute to yield improvement for electrically sensitive products.
3. The third benefit of applying the passivation is the surface energy change from hydrophobic to hydrophilic. A hydrophilic surface is easy to clean and the risk of mold pop-up effects due to remaining particles on the chip backside is reduced.