Plasma cleaning prior encapsulation with mold compound and in FlipChip packaging underfill technology (CUF, MUF)* has become a must for yield improvement. Advanced Flip Chip devices are gaining in market prominence, and microwave plasma processes are unrivalled at penetrating the minute gaps beneath the dies. All surfaces, regardless of the volume under the die are perfectly activated and conditioned. PVA TePla’s microwave plasma consistently performs, providing void-free encapsulation and FlipChip underfill, optimum adhesion and a dramatically enhanced wicking speeds.
*CUF = Capillary Underfill, MUF = Mold Underfill