Batch Processing Systems
Batch processing is still the most economic way of processing. Different system configurations and automation levels support each application from the simple laboratory to advanced production line for resist ashing, cleaning for packaging and as well as for medical devices.
Single Wafer Systems
Manual systems have the advantage of loading many different substrate sizes as single wafer or in mini-batch configuration. Different types of plasma sources allow different applications from resist treatment to etching processes for thin wafers and 3D interconnects. The same configuration of chamber and plasma source is also available with automatic wafer loading to bring the process from R&D to production.
Our metrology systems feature different hard ware platforms with either manual or automatic loading of the device to be tested, ranging for a small acoustic microscope for small substrates over automatic measurement systems for stress, implant dose and energy or surface contamination to a fully automatic system for Ingot Inspection.
Strip Type Systems
Processing systems with manual loading for batches or automatic loading of single strips to clean the substrates before wire bonding or encapsulation using both RF and microwave excitation to create the processing environment most suitable for the desired process result.
Small atmospheric plasma source for local activation.
Large plasma systems for cleaning of printed circuit boards before plating.