SIRD and SIRIS Stress Imaging System
The SIRD and SIRIS systems utilize the optical transmission of polarized laser light, detecting the depolarization of the transmitted light to reveal and measure defects in wafers up to 450mm in diameter.
TWIN Implant Monitoring System
The TWIN System is used to monitor implant processes by laser excitation and surface reflection to derive the correlation for implant dose and energy from the reflected signal. It can handle wafers up to 300mm in diameter and measure on monitor as well as product wafers.
Munich Metrology VPD Systems
Detecting contamination is a very difficult task, as the blank values of the system used to collect the sample must be significantly lower than the concentration of the contaminants to be detected. The VPD, Vapor Phase Decomposition, systems from Munich Metrology include the capability to cope with the task of collecting the sample, preparing the sample for analysis and providing the analysis with a fully automated system using a fully integrated ICP-MS. VPD Modules as well as fully automated sample and preparation systems are also available.
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Scanning Acoustic Microscopes
Ultra-sonic inspection is used for wafers, stacks, packaged devices and even ingots to detect defects within the device under test. The proprietary transducers with very high frequency in combination with different scanning regimes permit detection of even very small defects.
More Info: → www.pva-analyticalsystems.com