SIREX Device Stress Imaging System
The SIREX system also uses polarized light and measures the depolarization to by two highly sensitive analyzers. It operates in reflective mode using a very highle focused polarized laser beam. The scanning across the substrate is achieved by means of an X-Y-Theta stage with a resolution in micron-range. Hence the system can analyze a small area of the device or substrate with very high resolution, making it ideal for failure analysis on device level.
Different scanning modes and substrate chucks are available to cater for different devices and applications.
The SIREX inspection system includes special analysis programs, so the results will be presented in detailed mapsand numeric values for statistical process control applications. The analytical package allows post measurement analysis for global stress fields, localized defects, analysis of a small area and many more.