The plasma system 80 Plus is easy to operate and features same side loading and unloading, in manual and automatic mode. The System software complies to the standards in the semiconductor industry. Due to the very short process time the system can be integrated into fully automated assembly lines.
The 80 Plus is available in two configurations:
RF of 13.56 MHz is applied via electrode into the vacuum chamber to allow physical surface treatment via ion bombardment.
Microwave of 2,45 GHz is applied on top of the vacuum chamber producing a largely extended plasma producing
free radicals. Due to the use of microwaves the 80 Plus GIGA delivers fast, low temperature and damage free chemical surface treatment.