Application support is only possible with a certain capability to evaluate the process results. We are happy to offer the following analytical services for our customers:
Two microscopes one with high resolution camera imaging possibilities and the second with thickness measurement by spectrometer and SEM for small pieces of wafers or substrates.
Semi-automatic measurement system for film thickness with spectrometer up to 300mm, step height measurement system and capacitive wafer thickness measurement tool. Hi resolution scale to determine etch rate by weight loss.
Contact angle measurement
One automatic and one manual goniometric system to measure contact angle
Our cooperation partner university of the Bundeswehr will grant us access to several other surface analysis such as XPS, SIMS and EDX.